Patent Assignment
Reel/Frame 033164/0284
Assignment of Assignor's Interest
Recorded: 2014-06-24
Pages: 17
Assignors
JEON, SOOYEON
Executed: 2014-05-28
SENGUPTA, RWIK
Executed: 2014-05-15
PARK, CHULHONG
Executed: 2014-05-28
CHUN, KWANYOUNG
Executed: 2014-04-30
LEE, YUSUN
Executed: 2014-05-28
LEE, HYUN-JONG
Executed: 2014-05-28
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming the Same