IP Library Assignment 033169/0001
Patent Assignment
Reel/Frame 033169/0001

Assignment of Assignor's Interest

Recorded: 2014-06-24 Pages: 3
Assignor
WATANABE, KENICHI
Executed: 2014-06-17
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property (1)
Semiconductor Device Having Groove-Shaped Via-Hole
Patent: 9,406,613 →
Application: 14/313,010 →
Publication: US 2014/0299996
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 17, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035453/0904 →