Patent Assignment
Reel/Frame 033171/0879
Assignment of Assignor's Interest
Recorded: 2014-06-25
Pages: 5
Assignors
CHAN, TSUN-JEN
Executed: 2014-03-24
HU, CHENG-HUNG
Executed: 2014-03-24
CHEN, YI-HANN
Executed: 2014-03-24
CHANG, KANG-HUA
Executed: 2014-04-09
CHEN, MING-TE
Executed: 2014-03-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
High-Throughput System and Method for Post-Implantation Single Wafer Warm-Up