Patent Assignment
Reel/Frame 033173/0687
Assignment of Assignor's Interest
Recorded: 2014-06-25
Pages: 11
Assignors
CHOU, CHENG-HSIEN
Executed: 2014-06-18
CHOU, SHIH PEI
Executed: 2014-06-18
LAI, CHIH-YU
Executed: 2014-06-18
CHEN, SHENG-CHAU
Executed: 2014-06-18
CHEN, CHIH-TA
Executed: 2014-06-18
TU, YEUR-LUEN
Executed: 2014-06-18
TSAI, CHIA-SHIUNG
Executed: 2014-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Deep Trench Isolation Shrinkage Method for Enhanced Device Performance