Patent Assignment
Reel/Frame 033191/0968
Assignment of Assignor's Interest
Recorded: 2014-06-26
Pages: 6
Assignors
ZHAO, XING
Executed: 2014-06-11
NA, DUK JU
Executed: 2014-06-11
TAN, SIEW JOO
Executed: 2014-06-11
MARIMUTHU, PANDI C.
Executed: 2014-06-11
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Conductive Vias by Backside Via Reveal with CMP
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.