Patent Assignment
Reel/Frame 033192/0001
Assignment of Assignor's Interest
Recorded: 2014-06-26
Pages: 5
Assignors
ZHAO, XING
Executed: 2014-06-11
NA, DUK JU
Executed: 2014-06-11
CHIA, LAI YEE
Executed: 2014-06-11
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Conductive Vias by Direct Via Reveal with Organic Passivation
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.