Change of Name

Recorded: 2014-06-30 Pages: 14

Assignor

OKI ELECTRIC INDUSTRY CO., LTD.

Executed: 2008-10-01

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

2-4-8 SHINYOKOHAMA, KOUHOKU-KU, YOKOHAMA, 222-8575, JAPAN

Covered Property (1)

Semiconductor Chip Package and Multichip Package

Patent: 7,868,470 →

Application: 12/458,808 →

Publication: US 2009/0309205

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.