Change of Name

Recorded: 2014-06-30 Pages: 14

Assignor

OKI ELECTRIC INDUSTRY CO., LTD.

Executed: 2008-10-01

Assignee

LAPIS SEMICONDUCTOR CO., LTD.

2-4-8 SHINYOKOHAMA, KOUHOKU-KU, YOKOHAMA, 222-8575, JAPAN

Covered Property (1)

Semiconductor Device with Interface Peeling Preventing Rewiring Layer

Patent: 8,274,154 →

Application: 12/926,662 →

Publication: US 2011/0074032

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.