Patent Assignment
Reel/Frame 033213/0182
Assignment of Assignor's Interest
Recorded: 2014-06-30
Pages: 3
Assignor
HUANG, YU-LIEN
Executed: 2014-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Finfet Thermal Protection Methods and Related Structures