Patent Assignment
Reel/Frame 033216/0658
Assignment of Assignor's Interest
Recorded: 2014-07-01
Pages: 4
Assignors
YEH, MING-HSIN
Executed: 2014-04-21
TAI, HSIN
Executed: 2014-04-21
WU, CHAN-TSUN
Executed: 2014-04-22
Assignee
POWERCHIP TECHNOLOGY CORPORATION
NO. 12, LI-HSIN RD. I, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Method for Manufacturing Structure Having Air Gap
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049770/0160 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →