Patent Assignment
Reel/Frame 052337/0735
Assignment of Assignor's Interest
Recorded: 2020-04-08
Pages: 4
Assignor
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Executed: 2020-03-31
Assignee
POWERCHIP TECHNOLOGY CORPORATION
NO. 12, LI-HSIN RD. I, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Properties
(25)
Semiconductor Device Having Reduced Interconnect-Line Parasitic Capacitance
Method for Forming Stepped Contact Hole for Semiconductor Devices
Patent:
6,444,574 →
Application:
09/948,485 →
Method of Forming Stepped Contact Trench for Semiconductor Devices
Patent:
6,583,055 →
Application:
10/057,142 →
Method of Manufacturing Semiconductor Device
Patent:
6,670,254 →
Application:
10/065,298 →
Silicon-On-Insulator Device with Control Transistor
Method for Automatically Controlling Defect -Specification in a Semiconductor Manufacturing Process
Method for Producing a Gate
Patent:
6,699,755 →
Application:
10/249,212 →
Half-Tone Phase Shift Mask and Patterning Method Using Thereof
Re-Performable Spin-on Process
Method of Improving a Resolution of Contact Hole Patterns by Utilizing Alternate Phase Shift Principle
Method for Fabricating a Through Hole on a Semiconductor Substrate
Silicon-On-Insulator Device Structure
Method of Manufacturing Semiconductor Device
Method of Forming Contact Hole and Method of Fabricating Semiconductor Device
Method for Forming a Titanium Nitride Layer
Method of Fabricating Conductive Lines with Silicide Layer
Semiconductor Device Having Self-Aligned Contact
Method for Forming Buried Doped Region
Method of Fabricating Semiconductor Device
Method for Manufacturing Gate Dielectric Layer
Method of Manufacturing Self-Aligned Contact Openings
Manufacturing Method of Semiconductor Device Having Self-Aligned Contact
Method for Forming Contact Window
Method for Manufacturing Semiconductor Device
Method for Manufacturing Structure Having Air Gap
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Jun 24, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049562/0154 →
Change of Name
Jun 24, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049562/0151 →
Change of Name
Jun 27, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049623/0635 →
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0267 →
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0170 →
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0173 →
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0240 →
Assignment of Assignor's Interest
Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0121 →
Assignment of Assignor's Interest
Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0110 →
Assignment of Assignor's Interest
Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0132 →
Assignment of Assignor's Interest
Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049746/0981 →
Assignment of Assignor's Interest
Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049747/0017 →
Change of Name
Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0550 →
Change of Name
Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0536 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →