Patent Assignment
Reel/Frame 049732/0110
Assignment of Assignor's Interest
Recorded: 2019-07-12
Pages: 11
Assignor
POWERCHIP TECHNOLOGY CORPORATION
Executed: 2019-06-28
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(20)
Wafer Prober for in-Line Cleaning Probe Card
Patent:
6,420,891 →
Application:
09/640,184 →
Semiconductor Device Having Reduced Interconnect-Line Parasitic Capacitance
Method for Forming Stepped Contact Hole for Semiconductor Devices
Patent:
6,444,574 →
Application:
09/948,485 →
Method of Forming Stepped Contact Trench for Semiconductor Devices
Patent:
6,583,055 →
Application:
10/057,142 →
Method of Manufacturing Memory Device
Patent:
6,551,877 →
Application:
10/064,092 →
Method of Fabricating Memory Device
Structure, Fabrication and Operation Method of Flash Memory Device
Patent:
6,628,550 →
Application:
10/064,143 →
Memory Device Structure and Method of Fabricating the Same
Patent:
6,642,111 →
Application:
10/064,383 →
Manufacturing Method of Flash Memory
Split-Gate Flash Memory Structure and Method of Manufacture
Method of Manufacturing Semiconductor Device
Patent:
6,670,254 →
Application:
10/065,298 →
Trench Flash Memory Device and Method of Fabricating Thereof
Structure, Fabrication Method and Operation Method of Flash Memory
Structure of Flash Memory Device and Fabrication Method Thereof
Method for Reading Flash Memory with Silicon-Oxide/Nitride/Oxide-Silicon (Sonos) Structure
Patent:
6,639,836 →
Application:
10/065,565 →
Automatic Production Quality Control Method and System
Method of Cleaning a Probe Card
Silicon-On-Insulator Device with Control Transistor
Structure, Fabrication Method and Operating Method for Flash Memory
Single-Poly Eprom and Method for Forming the Same
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0170 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →