IP Library Assignment 053704/0522
Patent Assignment
Reel/Frame 053704/0522

Assignment of Assignor's Interest

Recorded: 2020-09-07 Pages: 5
Assignor
POWERCHIP TECHNOLOGY CORPORATION
Executed: 2020-09-04
Assignee
NEXCHIP SEMICONDUCTOR CORPORATION
NO. 88, XIFEIHE RD., HEFEI COMPREHENSIVE BONDED ZONE, XINZHAN DISTRICT, HEFEI CITY,, ANHUI PROVINCE, 230012, CHINA
Covered Properties (24)
Semiconductor Device Having Reduced Interconnect-Line Parasitic Capacitance
Patent: 6,531,776 →
Application: 09/940,852 →
Publication: US 2002/0132466
Method for Forming Stepped Contact Hole for Semiconductor Devices
Patent: 6,444,574 →
Application: 09/948,485 →
Method of Forming Stepped Contact Trench for Semiconductor Devices
Patent: 6,583,055 →
Application: 10/057,142 →
Method of Manufacturing Semiconductor Device
Patent: 6,670,254 →
Application: 10/065,298 →
Silicon-On-Insulator Device with Control Transistor
Patent: 6,828,633 →
Application: 10/248,868 →
Publication: US 2004/0089899
Method for Automatically Controlling Defect -Specification in a Semiconductor Manufacturing Process
Patent: 6,807,454 →
Application: 10/249,103 →
Publication: US 2003/0212469
Method for Producing a Gate
Patent: 6,699,755 →
Application: 10/249,212 →
Half-Tone Phase Shift Mask and Patterning Method Using Thereof
Patent: 7,461,472 →
Application: 10/250,228 →
Publication: US 2004/0253522
Re-Performable Spin-on Process
Patent: 6,881,590 →
Application: 10/604,895 →
Publication: US 2005/0048760
Method of Improving a Resolution of Contact Hole Patterns by Utilizing Alternate Phase Shift Principle
Patent: 7,008,733 →
Application: 10/605,377 →
Publication: US 2005/0069781
Method for Fabricating a Through Hole on a Semiconductor Substrate
Patent: 6,995,086 →
Application: 10/710,237 →
Publication: US 2005/0148168
Silicon-On-Insulator Device Structure
Patent: 7,019,582 →
Application: 10/711,624 →
Publication: US 2005/0029590
Method of Manufacturing Semiconductor Device
Patent: 7,056,787 →
Application: 10/905,610 →
Publication: US 2005/0233519
Method of Forming Contact Hole and Method of Fabricating Semiconductor Device
Patent: 7,098,124 →
Application: 10/908,871 →
Publication: US 2006/0134910
Method for Forming a Titanium Nitride Layer
Patent: 7,030,015 →
Application: 10/941,939 →
Publication: US 2005/0053722
Method of Fabricating Conductive Lines with Silicide Layer
Patent: 7,550,372 →
Application: 11/162,115 →
Publication: US 2006/0166497
Semiconductor Device Having Self-Aligned Contact
Patent: 7,612,433 →
Application: 11/162,725 →
Publication: US 2006/0183295
Method for Forming Buried Doped Region
Patent: 7,465,632 →
Application: 11/163,728 →
Publication: US 2006/0216915
Method of Fabricating Semiconductor Device
Patent: 7,268,055 →
Application: 11/163,980 →
Publication: US 2006/0252203
Method for Manufacturing Gate Dielectric Layer
Patent: 7,273,787 →
Application: 11/164,332 →
Publication: US 2006/0281251
Method of Manufacturing Self-Aligned Contact Openings
Patent: 7,429,527 →
Application: 11/853,025 →
Publication: US 2008/0003812
Manufacturing Method of Semiconductor Device Having Self-Aligned Contact
Patent: 7,803,692 →
Application: 12/562,142 →
Publication: US 2010/0003796
Method for Forming Contact Window
Patent: 8,722,538 →
Application: 13/610,913 →
Publication: US 2014/0011357
Method for Manufacturing Semiconductor Device
Patent: 8,822,303 →
Application: 13/620,730 →
Publication: US 2014/0004665
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Jun 24, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049562/0151 →
Change of Name Jun 24, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049562/0154 →
Change of Name Jun 27, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049623/0635 →
Change of Name Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0170 →
Change of Name Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0173 →
Change of Name Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0240 →
Change of Name Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0267 →
Assignment of Assignor's Interest Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0110 →
Assignment of Assignor's Interest Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0121 →
Assignment of Assignor's Interest Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0132 →
Assignment of Assignor's Interest Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049746/0981 →
Assignment of Assignor's Interest Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049747/0017 →
Change of Name Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0536 →
Change of Name Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0550 →
Assignment of Assignor's Interest Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →