IP Library Granted Patent US 7,461,472
Granted Patent B2
US 7,461,472 · App. 10/250,228 · Granted Dec 9, 2008

Half-tone phase shift mask and patterning method using thereof

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Quick Facts
Patent No.
US 7,461,472
App. No.
10/250,228
Granted
Dec 9, 2008
Kind
B2
Abstract

A half-tone phase shift mask including at least a mask substrate, a half-tone phase shift layer and a sheltering layer. The half-tone phase shift layer is a strip-like profile that forms on the surface of the mask substrate. The sheltering layer is formed on the two ends of the half-tone phase shift layer so that a portion of the half-tone phase shift layer is exposed. The sheltering layer has a width greater than the half-tone phase shift layer.

Claims (12)

1. A method of using a half-tone phase shift mask to form a strip pattern having two thicker ends and a narrower mid section, comprising the steps of:

providing a substrate; forming a material layer over the substrate; forming a photoresist layer on flee material layer;

patterning the photoresist layer using the half-tone phase shift mask, wherein the half-tone phase shift mask comprises: a mask substrate; two sheltering layers formed as first strips on the mask substrate with a space therebetween; a half-tone phase shift layer formed as a second strip and disposed at least in the space between the first strips, wherein the second strip is thinner than the first strips; and

patterning the material layer using the patterned photoresist layer as an etching mask to form the strip.

2. The method of claim 1 , wherein material forming the mask substrate comprises quartz glass.

3. The method of claim 1 , wherein the half-tone phase shift layer shifts the phase angle of an incoming light ray by 180°.

4. The method of claim 1 , wherein material forming the half-tone phase shift layer is selected from the group consisting of chromium oxy-nitride (CrON), chromium oxide (CrO), molybdenum silicon oxy-nitride 0VIoSOxNy), amorphous carbon and silicon nitride (SIN).

5. The method of claim 1 , wherein the half-tone phase shift layer has a light transmissivity between 4% to 10%.

6. The method of claim 1 , wherein the half-tone phase shift layer has a light transmissivity around 6%.

7. The method of claim 1 , wherein material forming the sheltering layer comprises chromium.

8. The method of claim 1 , wherein the material layer comprises a conductive layer.

9. The method of claim 1 , wherein the material layer comprises a dielectric layer.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0121 →
CHANGE OF NAME Recorded Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2003
From: LAI, JUN-CHENG
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 013731/0579 →