Patent Assignment
Reel/Frame 049629/0170
Change of Name
Recorded: 2019-06-28
Pages: 3
Assignor
POWERCHIP SEMICONDUCTOR CORP.
Executed: 2010-08-09
Assignee
POWERCHIP TECHNOLOGY CORPORATION
NO.12, LI-HSIN ROAD 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(20)
Wafer Prober for in-Line Cleaning Probe Card
Patent:
6,420,891 →
Application:
09/640,184 →
Semiconductor Device Having Reduced Interconnect-Line Parasitic Capacitance
Method for Forming Stepped Contact Hole for Semiconductor Devices
Patent:
6,444,574 →
Application:
09/948,485 →
Method of Forming Stepped Contact Trench for Semiconductor Devices
Patent:
6,583,055 →
Application:
10/057,142 →
Method of Fabricating Memory Device
Structure, Fabrication and Operation Method of Flash Memory Device
Patent:
6,628,550 →
Application:
10/064,143 →
Split-Gate Flash Memory Structure and Method of Manufacture
Method of Manufacturing Semiconductor Device
Patent:
6,670,254 →
Application:
10/065,298 →
Trench Flash Memory Device and Method of Fabricating Thereof
Structure, Fabrication Method and Operation Method of Flash Memory
Structure of Flash Memory Device and Fabrication Method Thereof
Method for Reading Flash Memory with Silicon-Oxide/Nitride/Oxide-Silicon (Sonos) Structure
Patent:
6,639,836 →
Application:
10/065,565 →
Automatic Production Quality Control Method and System
Method of Cleaning a Probe Card
Method of Manufacturing High Coupling Ratio Flash Memory Having Sidewall Spacer Floating Gate Electrode
Silicon-On-Insulator Device with Control Transistor
Flash Memory with Self-Aligned Split Gate and Methods for Fabricating and for Operating the Same
Patent:
6,765,260 →
Application:
10/249,024 →
Flash memory cell including two floating gates and an erasing gate
Method for Automatically Controlling Defect -Specification in a Semiconductor Manufacturing Process
Single-Poly Eprom and Method for Forming the Same
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0110 →
Assignment of Assignor's Interest
Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0121 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →