Patent Assignment
Reel/Frame 049629/0267
Change of Name
Recorded: 2019-06-28
Pages: 3
Assignor
POWERCHIP SEMICONDUCTOR CORP.
Executed: 2010-08-09
Assignee
POWERCHIP TECHNOLOGY CORPORATION
NO. 12, LI-HSIN ROAD 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(18)
Manufacturing Method a Flash Memory Cell Array
Flash Memory Cell, Flash Memory Cell Array and Manufacturing Method Thereof
Device for Processing Discharging Exhaust Gas
Method of Forming Contact Hole and Method of Fabricating Semiconductor Device
Method of Applying Micro-Protection in Defect Analysis
One-Time Programmable Read Only Memory and Operating Method Thereof
Semiconductor Facility
Mask Management Method and Bar Code Reading Apparatus Thereof
Method of Fabricating a Non-Volatile Memory
Non-Volatile Memory Device and Manufacturing Method and Operating Method Thereof
P-Channel Nand Flash Memory and Operating Method Thereof
Nonvolatile Memory
Method for Manufacturing One-Time Electrically Programmable Read Only Memory
Multi-Level Memory Cell and Fabricating Method Thereof
Auto-Recovery Wafer Testing Apparatus and Wafer Testing Method
Flash Memory Cell Structure and Operating Method Thereof
Flash Memory Cell and Manufacturing Method Thereof
Wafer Defect Detection Methods and Systems
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049747/0001 →
Assignment of Assignor's Interest
Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049747/0017 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →