Patent Assignment
Reel/Frame 049757/0536
Change of Name
Recorded: 2019-07-16
Pages: 11
Assignor
POWERCHIP TECHNOLOGY CORPORATION
Executed: 2019-06-28
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(20)
Method for Fabricating Semiconductor Device
Method for Forming Trench Gate Dielectric Layer
Non-Volatile Memory and Manufacturing and Operating Method Thereof
Method of Fabricating Non-Volatile Memory
Flash Memory
Non-Volatile Memory Including Assist Gate
Method for Manufacturing Semiconductor Devices and Plug
Method of Fabricating Non-Volatile Memory
Patent:
7,144,774 →
Application:
11/162,082 →
Method of Fabricating Conductive Lines with Silicide Layer
Non-Volatile Memory and Fabricating Method and Operating Method Thereof
Wafer Measuring Fixture
Method of Operating P-Channel Memory
Non-Volatile Memory Structure and Method of Fabricating Non-Volatile Memory
Non-Volatile Memory Device
Wafer Defect Detection Methods and Systems
Methods for Determining Tool Assignment Preference and Manufacturing Systems Using the Same
Methods and Systems for Semiconductor Defect Detection
Method of Piping Defect Detection
Inspection Methods for a Semiconductor Device
Real-Time Management Systems and Methods for Manufacturing Management and Yield Rate Analysis Integration
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Jun 27, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049623/0635 →
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0267 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →