Method of piping defect detection
View Patent ↗A method of piping defect detection is provided. A semiconductor substrate having an active region and an isolation region is provided, a plurality of semiconductor elements are formed on the semiconductor substrate, a dielectric layer is deposited on the semiconductor substrate and the semiconductor elements, and first and second contact plugs are formed in the dielectric layer to connect the active region and the isolation region respectively. The first contact plug and the second contact plug are illuminated by an electron beam, accumulating charge on the second contact plug, and piping defects are detected between the first contact plug and the second contact plug according to brightness contrast between the first contact plug and the second contact plug.
1. A method of piping defect detection, comprising:
providing a semiconductor substrate having an active region and an isolation region thereon;
forming a plurality of semiconductor elements on the semiconductor substrate;
depositing a dielectric layer on the semiconductor substrate and the semiconductor elements;
forming first and second contact plugs in the dielectric layer to connect the active region and the isolation region respectively; and
illuminating the first contact plug and the second contact plug by an electron beam, accumulating charge on the second contact plug, and determining if piping defects exist between the first contact plug and the second contact plug according to brightness contrast between the first contact plug and the second contact plug.
2. The method of claim 1 , wherein brightness contrast is detected by scanning electron microscope or a defect detection device.
3. The method of claim 1 , wherein the active region comprises an ion-doped region.
4. The method of claim 1 , wherein the isolation region comprises a local oxidation structure or a shallow trench isolation structure.
5. The method of claim 1 , wherein the semiconductor element comprises a MOS transistor.
6. The method of claim 1 , wherein the first contact plug and the second contact plug are polysilicon contact plugs.
7. The method of claim 1 , further comprising changing voltage of the electron beam, illumination time or observation magnification during illumination of the first and the second contact plugs by an electron beam.
8. The method of claim 1 , wherein piping defects are detected when brightness contrast between the first contact plug and the second contact plug has not been observed after illuminating the first contact plug and the second contact plug by an electron beam.