Patent Assignment
Reel/Frame 049746/0981
Assignment of Assignor's Interest
Recorded: 2019-07-14
Pages: 11
Assignor
POWERCHIP TECHNOLOGY CORPORATION
Executed: 2019-06-28
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(20)
Method for Fabricating a Through Hole on a Semiconductor Substrate
Device and Method for Testing an Exposure Apparatus
Method of Fluoride-Containing Wastewater Treatment
[Dummy Process and Polishing-Pad Conditioning Process for Chemical Mechanical Polishing Apparatus]
Patent:
6,913,516 →
Application:
10/710,508 →
[Auto-Recovery Wafer Testing Apparatus and Wafer Testing Method]
Method of Manufacturing a Dual Bit Flash Memory
Method of Manufacturing Photodiode
[Split-Gate Flash Memory Structure and Method of Manufacture]
Support Stand
Patent:
6,914,732 →
Application:
10/710,853 →
Method of Managing Wafer Defects
Method of Manufacturing Non-Volatile Memory Cell
Flash Memory Cell and Fabricating Method Thereof
Silicon-On-Insulator Device Structure
Operational Model for Simulating Manufacture Flow and Simulating Method Thereof
Non-Volatile Memory, Non-Volatile Memory Array and Manufacturing Method Thereof
Method of Fabricating a Flash Memory Cell
Flash Memory Cell and Fabricating Method Thereof
Method for Forming a Titanium Nitride Layer
Method of Fabricating a Photosensitive Structure
Capacity Management System and Method
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Jun 24, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049562/0154 →
Change of Name
Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0240 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →