IP Library Granted Patent US 7,221,994
Granted Patent B2
US 7,221,994 · App. 10/904,383 · Granted May 22, 2007

Operational model for simulating manufacture flow and simulating method thereof

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Quick Facts
Patent No.
US 7,221,994
App. No.
10/904,383
Granted
May 22, 2007
Kind
B2
Abstract

The present invention discloses an operational model for simulating a manufacturing flow. The operational model includes an operational block, an operational library, a strategic block and a strategic library. The operational block is built in accordance with operational data of the equipments, and the operational library is built by integrating a plurality of operational blocks. The strategic block is built in accordance with throughput data of the equipments, and the strategic library is built by integrating a plurality of strategic blocks.

Claims (23)

1. A simulating method of manufacturing flow which is applied in a semiconductor foundry, the simulating method comprising:

building a plurality of operational blocks in accordance with operational data of each manufacturing equipment;

integrating the operational blocks and building at least one operational library;

building a plurality of strategic blocks in accordance with throughput data of each manufacturing equipment;

integrating the strategic blocks and building at least one strategic library;

collecting data from the operational library and strategic library and building a operational model; and

performing manufacturing flow simulation in accordance with the operational model.

2. The method of claim 1 wherein the manufacturing equipments include process equipments, transferring equipments, material delivering equipments and material storage equipments.

3. The method of claim 1 wherein the operational equipments include etching equipments, exposure equipments, rail guided vehicles (RGV) and stockers.

4. The method of claim 1 wherein the operational data comprises each hardware specification data, operational data, and user demand specification data of the manufacturing equipments.

5. The method of claim 1 wherein the throughput data comprises each manufacturing flow data, operational procedure data, and material transfer flow data of the manufacturing equipments.

6. The method of claim 1 wherein when the operational model is built, a 12-inch wafer foundry model is established.

7. The method of claim 1 wherein when the operational model is built, a section manufacturing line is established.

8. An operational model simulation of a 12-inch wafer foundry built in accordance with the method of claim 1 .

9. An operational model simulating the manufacturing flow of a semiconductor foundry, the operational model comprising:

an operational library including a plurality of operational blocks built in accordance with each operational data of each manufacturing equipment; and

a strategic library including a plurality of strategic blocks built in accordance with each throughout data of each manufacturing equipment.

10. The model of claim 9 wherein the manufacturing equipments include process equipments, material transfer equipments and material storage equipments.

11. The model of claim 9 wherein the process equipments include etching equipments, exposure equipments, rail guided vehicles (RGV) and stockers.

12. The model of claim 9 wherein the operational data comprises each hardware specification data, operational specification data, and user demand specification data of the manufacturing equipments.

13. The model of claim 9 wherein the throughput data comprises each manufacturing flow data, operational procedure data, and material transfer flow data of the manufacturing equipments.

14. The model of claim 9 wherein the operational model is a complete 12-inch wafer foundry model.

15. The model of claim 9 wherein operational model is a section manufacturing line model.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049746/0981 →
CHANGE OF NAME Recorded Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0240 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2004
From: SUNG, WAY-CHENG; TSAI, TUNG-HUANG
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 015338/0247 →