Patent Assignment
Reel/Frame 033219/0673
Assignment of Assignor's Interest
Recorded: 2014-07-01
Pages: 2
Assignors
CHENG, LI-HUI
Executed: 2014-06-20
TSAI, PO-HAO
Executed: 2014-06-20
LIN, JING-CHENG
Executed: 2014-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices