Patent Assignment
Reel/Frame 033228/0310
Assignment of Assignor's Interest
Recorded: 2014-07-02
Pages: 8
Assignors
LIU, HSIANG-WEI
Executed: 2014-06-24
YANG, TAI-I
Executed: 2014-06-24
CHUANG, CHENG-CHI
Executed: 2014-06-24
LIN, TIEN-LU
Executed: 2014-06-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Hybrid Copper Structure for Advance Interconnect Usage