Patent Assignment
Reel/Frame 033231/0069
Assignment of Assignor's Interest
Recorded: 2014-07-02
Pages: 3
Assignor
TUN, TIN
Executed: 2014-06-26
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Selective Component Bonding Technique
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.