IP Library Assignment 061608/0496
Patent Assignment
Reel/Frame 061608/0496

Assignment of Assignor's Interest

Recorded: 2022-11-01 Pages: 9
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2022-10-26
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties (28)
Suspended Membrane Device
Patent: 9,000,542 →
Application: 13/907,708 →
Publication: US 2014/0353773
Absolute Temperature Method for Disposable Glucose Strip
Patent: 9,435,763 →
Application: 13/929,515 →
Publication: US 2015/0001071
Combo Bio and Temperature Disposable Sensor on Flexible Foil
Patent: 9,437,798 →
Application: 13/929,525 →
Publication: US 2015/0001075
Infrared Camera Sensor
Patent: 9,018,723 →
Application: 13/929,610 →
Publication: US 2015/0001659
Optical Package with Recess in Transparent Cover
Patent: 9,608,029 →
Application: 13/931,313 →
Publication: US 2015/0001111
Electronic Modules
Patent: 9,018,753 →
Application: 13/958,146 →
Publication: US 2015/0035133
Optical Assembly Including Electrically Conductive Coupling Member and Related Methods
Patent: 9,671,671 →
Application: 14/050,522 →
Publication: US 2015/0103297
Optical Sensor Package
Patent: 9,543,282 →
Application: 14/083,102 →
Publication: US 2015/0137148
Camera Module
Patent: 9,258,467 →
Application: 14/084,410 →
Publication: US 2015/0138436
Method of Processing a Semiconductor Wafer Such as to Make Prototypes and Related Apparatus
Patent: 9,377,678 →
Application: 14/084,773 →
Publication: US 2015/0140479
Method to Provide the Thinnest and Variable Substrate Thickness for Reliable Plastic and Flexible Electronic Device
Patent: 9,257,423 →
Application: 14/090,673 →
Publication: US 2015/0145137
Method for Making Semiconductor Devices Including Reactant Treatment of Residual Surface Portion
Patent: 9,236,243 →
Application: 14/151,188 →
Publication: US 2015/0194303
Low Profile Camera Module with Image Compensation
Patent: 9,723,186 →
Application: 14/183,937 →
Publication: US 2015/0237245
Flexible Electrochemical Micro-Sensor
Patent: 9,918,667 →
Application: 14/200,828 →
Publication: US 2015/0253276
Selective Component Bonding Technique
Patent: 9,638,884 →
Application: 14/322,054 →
Publication: US 2016/0004029
System-In-Packages and Methods for Forming Same
Patent: 9,252,030 →
Application: 14/450,554 →
Publication: US 2016/0035590
Compact Microelectronic Integrated Gas Sensor
Patent: 9,851,328 →
Application: 14/462,432 →
Publication: US 2016/0047774
Gas Sensor Device with Frame Passageways and Related Methods
Patent: 9,448,216 →
Application: 14/511,280 →
Publication: US 2016/0103109
Patterned Lead Frame
Patent: 9,754,861 →
Application: 14/512,208 →
Publication: US 2016/0104663
Error Correction in Memory Devices by Multiple Readings with Different References
Patent: 9,430,328 →
Application: 14/597,845 →
Publication: US 2015/0212881
High Throughput Programming System and Method for a Phase Change Non-Volatile Memory Device
Patent: 9,697,896 →
Application: 14/623,300 →
Publication: US 2015/0243356
Method of Making a Suspended Membrane Device
Patent: 9,598,278 →
Application: 14/679,906 →
Publication: US 2015/0210539
Integrated Circuit (Ic) Card Having an Ic Module and Reduced Bond Wire Stress and Method of Forming
Patent: 9,449,912 →
Application: 14/736,353 →
Method for Making Semiconductor Devices Including Reactant Treatment of Residual Surface Portion
Patent: 9,524,866 →
Application: 14/957,141 →
Publication: US 2016/0093490
Method to Provide the Thinnest and Variable Substrate Thickness for Reliable Plastic and Flexible Electronic Device
Patent: 9,530,681 →
Application: 14/986,130 →
Publication: US 2016/0118289
Compact Microelectronic Integrated Gas Sensor
Application: 15/812,731 →
Publication: US 2018/0067074
Flexible Electrochemical Micro-Sensor
Application: 15/873,557 →
Publication: US 2018/0140234
Flexible Electrochemical Micro-Sensor
Application: 16/407,054 →
Publication: US 2019/0261899
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 21, 2013
From: LOH, TIEN CHOY; LE NEEL, OLIVIER
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030659/0712 →
Assignment of Assignor's Interest Jul 29, 2013
From: WONG, WING SHENQ
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030897/0285 →
Assignment of Assignor's Interest Aug 1, 2013
From: LE NEEL, OLIVIER; CHERIAN, SUMAN; LEUNG, CALVIN; SHANKAR, RAVI
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030921/0675 →
Assignment of Assignor's Interest Aug 5, 2013
From: WONG, WING SHENQ
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030938/0767 →
Assignment of Assignor's Interest Aug 6, 2013
From: LE NEEL, OLIVIER; CHERIAN, SUMAN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 030949/0257 →
Assignment of Assignor's Interest Sep 26, 2013
From: LE NEEL, OLIVIER; SHANKAR, RAVI; LOH, TIEN CHOY
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 031293/0155 →
Assignment of Assignor's Interest Oct 15, 2013
From: LIM, WEE CHIN JUDY; GANI, DAVID; LOOI, HK; AW, BS
To: STMICROELECTRONICS PTE LTD
Reel/Frame 031406/0591 →
Assignment of Assignor's Interest Nov 18, 2013
From: WONG, WING SHENQ
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 031624/0050 →
Assignment of Assignor's Interest Nov 19, 2013
From: WONG, WING SHENQ
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 031689/0816 →
Assignment of Assignor's Interest Nov 20, 2013
From: LEE, ALAN; GE, XI
To: STMICROELECTRONICS PTE LTD
Reel/Frame 031642/0353 →
Assignment of Assignor's Interest Jan 10, 2014
From: LEUNG, CALVIN; LE NEEL, OLIVIER
To: STMICROELECTRONICS PTE. LTD.
Reel/Frame 031969/0851 →
Assignment of Assignor's Interest Jan 13, 2014
From: CHEW, CHONG JIEH
To: STMICROELECTRONICS PTE LTD
Reel/Frame 031949/0308 →
Assignment of Assignor's Interest Feb 19, 2014
From: RENARD, LOIC PIERRE LOUIS; LIM, WEE CHIN JUDY
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 032248/0615 →
Assignment of Assignor's Interest Jul 2, 2014
From: TUN, TIN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 033231/0069 →
Assignment of Assignor's Interest Aug 4, 2014
From: JIN, YONGGANG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 033457/0349 →
Assignment of Assignor's Interest Dec 5, 2014
From: TEYSSEYRE, JEROME; JIN, YONGGANG; CHERIAN, SUMAN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 034396/0125 →
Assignment of Assignor's Interest Feb 17, 2015
From: LE NEEL, OLIVIER; CHERIAN, SUMAN; LEUNG, CALVIN
To: STMICROELECTRONICS PTE. LTD.
Reel/Frame 034972/0368 →