Patent Assignment
Reel/Frame 031969/0851
Assignment of Assignor's Interest
Recorded: 2014-01-10
Pages: 3
Assignee
STMICROELECTRONICS PTE. LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Method to Provide the Thinnest and Variable Substrate Thickness for Reliable Plastic and Flexible Electronic Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.