Patent Assignment
Reel/Frame 033235/0742
Assignment of Assignor's Interest
Recorded: 2014-07-02
Pages: 4
Assignors
SHIH, WAN-TING
Executed: 2014-06-11
LIU, NAI-WEI
Executed: 2014-06-09
LIN, JING-CHENG
Executed: 2014-06-09
HUANG, CHENG-LIN
Executed: 2014-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Fan-Out Package and Methods of Forming Thereof