IP Library › Assignment 033257/0811
Patent Assignment
Reel/Frame 033257/0811

Assignment of Assignor's Interest

Recorded: 2014-07-08 Pages: 5
Assignors
GOVINDARAJU, SRIDHAR
Executed: 2013-12-20
DASGUPTA, ANINDYA
Executed: 2013-12-20
GROVER, ROHIT
Executed: 2013-12-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Using Materials with Different Etch Rates to Fill Trenches in Semiconductor Devices
Patent: 9,704,798 →
Application: 14/137,497 →
Publication: US 2015/0179567