IP Library Assignment 033261/0975
Patent Assignment
Reel/Frame 033261/0975

Assignment of Assignor's Interest

Recorded: 2014-07-08 Pages: 4
Assignors
KIM, SUNG JIN
Executed: 2014-07-08
KIM, JUN IL
Executed: 2014-07-08
KIM, HAG MO
Executed: 2014-07-08
Assignee
DONGBU HITEK CO., LTD.
432, TEHERAN-RO, GANGNAM-GU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property (1)
COF Type Semiconductor Package and Method of Manufacturing the Same
Patent: 9,406,583 →
Application: 14/370,391 →
Publication: US 2015/0262906
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD.
Reel/Frame 044559/0819 →
Assignment of Assignor's Interest Jun 21, 2024
From: DB HITEK CO., LTD.
To: DB GLOBALCHIP CO., LTD.
Reel/Frame 067800/0572 →