Patent Assignment
Reel/Frame 033262/0168
Assignment of Assignor's Interest
Recorded: 2014-07-08
Pages: 4
Assignors
LIN, CHIH-WEI
Executed: 2014-06-30
CHEN, SHING-CHAO
Executed: 2014-06-30
CHEN, MENG-TSE
Executed: 2014-06-30
CHENG, MING-DA
Executed: 2014-06-30
LIU, CHUNG-SHI
Executed: 2014-07-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Rdl-First Packaging Process