IP Library › Assignment 033262/0321
Patent Assignment
Reel/Frame 033262/0321

Assignment of Assignor's Interest

Recorded: 2014-07-08 Pages: 4
Assignors
FANG, WEI
Executed: 2014-04-14
ZHANG, ZHAOLI
Executed: 2014-04-14
JAU, JACK
Executed: 2014-04-14
Assignee
HERMES-MICROVISION, INC.
7F, NO.18, PUDING RD., EAST DIST., HSINCHU CITY, 300, TAIWAN
Covered Property (1)
Method and System of Classifying Defects on a Wafer
Patent: 9,436,988 →
Application: 14/325,802 →
Publication: US 2014/0321730
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →