IP Library Assignment 033270/0236
Patent Assignment
Reel/Frame 033270/0236

Assignment of Assignor's Interest

Recorded: 2014-07-09 Pages: 12
Assignors
FENOUILLET-BERANGER, CLAIRE
Executed: 2013-09-13
DENORME, STEPHANE
Executed: 2013-09-08
LOUBET, NICOLAS
Executed: 2013-08-29
LIU, QING
Executed: 2013-08-29
RICHARD, EMMANUEL
Executed: 2013-08-30
PERREAU, PIERRE
Executed: 2013-09-17
Assignees
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300, MAIL STATION 2346, COPPELL, TEXAS, 75019
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, F-92120, FRANCE
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, 38926, FRANCE
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
25 RUE LEBLANC, BATIMENT LE PONANT D, PARIS, 75015, FRANCE
Covered Property (1)
Method for Manufacturing a Hybrid Soi/Bulk Semiconductor Wafer
Patent: 8,877,600 →
Application: 14/104,903 →
Publication: US 2014/0170834
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 23, 2024
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 066663/0136 →