Patent Assignment
Reel/Frame 033272/0528
Assignment of Assignor's Interest
Recorded: 2014-07-09
Pages: 2
Assignors
CHEN, JIE
Executed: 2014-07-01
CHEN, YING-JU
Executed: 2014-07-01
CHEN, HSIEN-WEI
Executed: 2014-07-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices