Patent Assignment
Reel/Frame 033280/0372
Assignment of Assignor's Interest
Recorded: 2014-07-09
Pages: 6
Assignors
PARK, JAE-HWA
Executed: 2014-06-09
KANG, SUNG-HEE
Executed: 2014-06-09
MOON, KWANG-JIN
Executed: 2014-06-09
PARK, BYUNG-LYUL
Executed: 2014-06-09
BANG, SUK-CHUL
Executed: 2014-06-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Including Through-Silicon via Structure and Decoupling Capacitor and Method of Manufacturing the Same