Patent Assignment
Reel/Frame 033311/0668
Assignment of Assignor's Interest
Recorded: 2014-07-15
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure Having Air Gap and Method of Forming the Same