IP Library › Assignment 033322/0567
Patent Assignment
Reel/Frame 033322/0567

Assignment of Assignor's Interest

Recorded: 2014-07-16 Pages: 4
Assignors
WANG, YEH-CHIEH
Executed: 2014-07-11
PAI, JIUN-RONG
Executed: 2014-07-04
LIU, HSU-SHUI
Executed: 2014-07-14
LEE, CHENG-LUNG
Executed: 2014-07-04
LIOU, KUANG-CHUNG
Executed: 2014-07-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Wafer Chuck
Patent: 9,786,539 →
Application: 14/332,643 →
Publication: US 2016/0020128