Patent Assignment
Reel/Frame 033327/0636
Assignment of Assignor's Interest
Recorded: 2014-07-16
Pages: 4
Assignors
HSIEH, CHENG-CHIEH
Executed: 2011-07-18
HUANG, CHENG-LIN
Executed: 2011-07-18
TSAI, PO-HAO
Executed: 2011-07-18
HOU, SHANG-YUN
Executed: 2011-07-18
LIN, JING-CHENG
Executed: 2011-07-18
JENG, SHIN-PUU
Executed: 2011-07-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pillar Design for Conductive Bump
Application:
13/189,127 →
Publication:
US 2013/0020698