Patent Assignment
Reel/Frame 033363/0619
Assignment of Assignor's Interest
Recorded: 2014-07-22
Pages: 3
Assignors
CHANG, CHE-CHENG
Executed: 2014-07-14
CHENG, TUNG-WEN
Executed: 2014-07-14
HSEIH, JUI FU
Executed: 2014-07-14
LIN, MU-TSANG
Executed: 2014-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure with Shallow Trench Isolation and Manufacturing Method Thereof