IP Library Assignment 033392/0699
Patent Assignment
Reel/Frame 033392/0699

Assignment of Assignor's Interest

Recorded: 2014-07-23 Pages: 3
Assignors
KANG, TAE MIN
Executed: 2014-07-01
LEE, DAE WOONG
Executed: 2014-07-01
KIM, JONG HOON
Executed: 2014-07-01
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Chip and Semiconductor Package Having the Same
Patent: 9,543,251 →
Application: 14/339,029 →
Publication: US 2015/0270229
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 7, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067335/0246 →