Assignment of Assignor's Interest

Recorded: 2014-07-28 Pages: 3

Assignors

ESPIRITU, EMMANUEL

Executed: 2014-06-30

ILAGAN, ALLAN PUMATONG

Executed: 2014-06-30

PUNZALAN, JEFFREY DAVID

Executed: 2014-06-30

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Integrated Circuit Packaging System with Coreless Substrate and Method of Manufacture Thereof

Patent: 9,305,809 →

Application: 14/316,461 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.