Patent Assignment
Reel/Frame 033420/0656
Assignment of Assignor's Interest
Recorded: 2014-07-30
Pages: 7
Assignors
COLONNA, JEAN-PHILIPPE
Executed: 2014-07-10
JOBLOT, SYLVAIN
Executed: 2014-02-06
MOURIER, THIERRY
Executed: 2014-06-06
GUILLER, OLIVIER
Executed: 2014-02-10
Assignees
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, F-38926, FRANCE
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
25, RUE LEBLANC, BATIMENT LE PONANT D, PARIS, F-75015, FRANCE
Covered Property
(1)
Process for Producing a Through-Silicon via and a Through-Silicon Capacitor in a Substrate, and Corresponding Device