IP Library › Assignment 033450/0206
Patent Assignment
Reel/Frame 033450/0206

Corrective Assignment to Correct the Incorrect Appl. No. 14/175,686 Previously Recorded at Reel: 032175 Frame: 0415. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2014-07-29 Pages: 4
Assignors
LIN, RUEIJER
Executed: 2014-01-29
LEE, YA-LIEN
Executed: 2014-01-29
LIN, CHUN-CHIEH
Executed: 2014-01-29
SU, HUNG-WEN
Executed: 2014-01-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Interconnect Structure including a Conductive Feature and a Barrier Layer on Sidewalls and a Bottom Surface of the Conductive Feature and Method of Forming the Same
Application: 14/175,685 →
Publication: US 2015/0228605
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 7, 2014
From: LIN, RUEIJER; LEE, YA-LIEN; LIN, CHUN-CHIEH; SU, HUNG-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Reel/Frame 032175/0415 →