IP Library › Assignment 033464/0256
Patent Assignment
Reel/Frame 033464/0256

Change of Name

Recorded: 2014-08-04 Pages: 17
Assignor
FUJITSU MICROELECTRONICS LIMITED
Executed: 2010-04-01
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA KOHOKU-KU, YOKOHAMA-SHI, JAPAN
Covered Property (1)
Low-Noise Flip-Chip Packages and Flip Chips Thereof
Patent: 9,136,238 →
Application: 14/152,609 →
Publication: US 2014/0124930
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 16, 2014
From: DEDIC, IAN JUSO; ALI, GHAZANFER
To: FUJITSU LIMITED
Reel/Frame 031981/0587 →
Assignment of Assignor's Interest Apr 17, 2014
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 032697/0942 →
Assignment of Assignor's Interest Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0637 →