Patent Assignment
Reel/Frame 033487/0989
Assignment of Assignor's Interest
Recorded: 2014-08-07
Pages: 4
Assignors
TAN, SIOW CHEK
Executed: 2014-07-22
CHONG, SWEE FONG
Executed: 2014-07-22
TEH, PHEAK TI
Executed: 2014-07-22
Assignee
ALTERA CORPORATION
101 INNOVATION DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Circuit Package Substrates having a Common Die Dependent Region and Methods for Designing the Same
Patent:
9,780,040 →
Application:
14/454,115 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.