Patent Assignment
Reel/Frame 033494/0665
Assignment of Assignor's Interest
Recorded: 2014-08-08
Pages: 6
Assignors
PARK, SANG-JINE
Executed: 2014-07-16
YOON, BO-UN
Executed: 2014-07-17
JEON, HA-YOUNG
Executed: 2014-07-16
CHO, BYUNG-KWON
Executed: 2014-07-16
HAN, JEONG-NAM
Executed: 2014-07-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Trench Walls Having Multiple Slopes