Patent Assignment
Reel/Frame 033502/0397
Assignment of Assignor's Interest
Recorded: 2014-08-11
Pages: 18
Assignors
HUNG, CHING-WEN
Executed: 2014-07-21
WU, JIA-RONG
Executed: 2014-07-21
CHANG, TSUNG-HUNG
Executed: 2014-07-21
LIN, CHING-LING
Executed: 2014-07-21
LEE, YI-HUI
Executed: 2014-07-21
HUANG, CHIH-SEN
Executed: 2014-07-21
CHEN, YI-WEI
Executed: 2014-07-21
LIN, CHUN-HSIEN
Executed: 2014-07-21
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Fabricating Semiconductor Device