Patent Assignment
Reel/Frame 033508/0791
Assignment of Assignor's Interest
Recorded: 2014-08-11
Pages: 4
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Electronic Component and Board Having the Same