Patent Assignment
Reel/Frame 033509/0439
Assignment of Assignor's Interest
Recorded: 2014-08-11
Pages: 10
Assignors
KARHADE, OMKAR G
Executed: 2014-06-23
DESHPANDE, NITIN A
Executed: 2014-08-08
VAIDYA, ADITYA S
Executed: 2014-06-23
RARAVIKAR, NACHIKET R
Executed: 2014-06-19
LI, ERIC J
Executed: 2014-06-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Novel Method and Materials for Warpage Thermal and Interconnect Solutions
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.