Patent Assignment
Reel/Frame 033511/0581
Assignment of Assignor's Interest
Recorded: 2014-08-12
Pages: 5
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods for Packaging a Microelectromechanical System (Mems) Wafer and Application-Specific Integrated Circuit (Asic) Dies Using Through Mold Vias (Tmvs)