Patent Assignment
Reel/Frame 033514/0900
Assignment of Assignor's Interest
Recorded: 2014-08-12
Pages: 6
Assignors
CHUN, HYUNSUK
Executed: 2014-06-29
PARK, SOOJAE
Executed: 2014-07-01
LEE, SEUNGBAE
Executed: 2014-06-30
HA, SANGSU
Executed: 2014-06-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Magnetic Connection Member