Patent Assignment
Reel/Frame 033524/0807
Assignment of Assignor's Interest
Recorded: 2014-08-13
Pages: 10
Assignors
NISHIMOTO, SHUJI
Executed: 2014-07-28
NISHIKAWA, KIMIHITO
Executed: 2014-07-28
NAGATOMO, YOSHIYUKI
Executed: 2014-07-28
Assignee
MITSUBISHI MATERIALS CORPORATION
3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Solder Joint Structure, Power Module, Power Module Substrate with Heat Sink and Method of Manufacturing the Same, and Paste for Forming Solder Base Layer